Wafer Grinder Spindle Ball Bearing Race from Mexico
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention. Specifically HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — Mexico → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Attach machine model compatibility and spindle RPM ratings to link to semiconductor use
• Document special coatings (e.g
• DLC for particle reduction) but classify by function
• Separate from grinder machine import to optimize duty rates