Wafer Grinder Spindle Ball Bearing Race from Germany
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention. Specifically HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — Germany → United States
34.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Attach machine model compatibility and spindle RPM ratings to link to semiconductor use
• Document special coatings (e.g
• DLC for particle reduction) but classify by function
• Separate from grinder machine import to optimize duty rates