Wafer Grinder Spindle Ball Bearing Race from Germany
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention. Specifically HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — Germany → United States
34.9%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Attach machine model compatibility and spindle RPM ratings to link to semiconductor use
• Document special coatings (e.g
• DLC for particle reduction) but classify by function
• Separate from grinder machine import to optimize duty rates