Wafer Grinder Spindle Ball Bearing Race from China
Custom outer race for ball bearings in semiconductor wafer grinders, ensuring flatness tolerances <1 μm across 300mm wafers. Hydrostatic groove design for lubricant retention. Specifically HTS 8482.99.05.00 for ball bearing outer rings.
Duty Rate — China → United States
44.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Attach machine model compatibility and spindle RPM ratings to link to semiconductor use
• Document special coatings (e.g
• DLC for particle reduction) but classify by function
• Separate from grinder machine import to optimize duty rates