Wire Bonding Machine Fluid Valve

Fluid control valve for wire bonding equipment in semiconductor packaging, managing cooling during gold/aluminum wire attachment to dies. HTS 8481.90.9085 as 'other' semiconductor processing part.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳ChinaFree+35.0%35%
🇲🇽MexicoFree+10.0%10%
🇨🇦CanadaFree+10.0%10%
🇩🇪GermanyFree+10.0%10%
🇯🇵JapanFree+10.0%10%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8468.10.00Lower: 20.4% vs 35%

If Wire bonding resembles specialized soldering.

8515.90.40Same rate: 35%

If electronic soldering parts

Wave solder equipment uses Chapter 85.

8424.89.90Higher: 36.8% vs 35%

If general mechanical handling

Non-semiconductor bonders default Chapter 84.

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Import Tips & Compliance

Tie to statistical notes via bonding temp/pressure specs

ESD-safe certifications for handling

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