Other
Taps, cocks, valves and similar appliances, for pipes, boiler shells, tanks, vats or the like, including pressure-reducing valves and thermostatically controlled valves; parts thereof: > Parts: > Other > Other: > Other: > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8481.90.90.85
Wafer Prep Lapper Flow Regulator
Adjustable flow regulator valve for lapping machines maintaining consistent slurry pressure across wafer surface for tolerance compliance. Under HTS 8481.90.9085, statistical (a)(ii)(C).
Monocrystalline Silicon boule Vacuum Valve
Vacuum isolation valve for boule processing chambers preventing contamination during wafer slicing/grinding prep. HTS 8481.90.9085 for semiconductor wafer manufacturing equipment parts.
Semiconductor Wafer Grinder Air Valve
Pneumatic air valve actuating wafer grinder spindles for precise boule diameter control in prep equipment. Per HTS 8481.90.9085, note (a)(ii)(A/C).
Wafer Lapping Machine Slurry Valve
Corrosion-resistant valve dosing abrasive slurry in wafer lappers achieving sub-micron flatness for fabrication readiness. Classified HTS 8481.90.9085 under statistical note (a)(ii)(C) for wafer grinder/lappers/polishers.
Semiconductor Wafer Processing Valve
A precision stainless steel valve designed for controlling gas flow in semiconductor wafer processing equipment, such as crystal growers and pullers using Czochralski methods. It falls under HTS 8481.90.9085 as a part of semiconductor manufacturing apparatus classified as 'other' parts of valves for pipes and tanks. This ensures accurate classification separate from general industrial valves.
Czochralski Crystal Puller Flow Control Valve
High-purity valve for regulating argon or nitrogen flow in Czochralski crystal growers used to produce monocrystalline silicon boules for wafers. Classified under HTS 8481.90.9085 as 'other' parts tailored for semiconductor material growth equipment. Meets statistical note (a)(i) for crystal pullers.
Float Zone Crystal Grower Inlet Valve
Specialized inlet valve for vacuum-sealed float zone crystal growers producing high-purity silicon ingots from polycrystalline rods. HTS 8481.90.9085 covers it as 'other' valve parts for semiconductor crystal growth per statistical note (a)(i). Ensures contamination-free operation.
Wafer Slicing Saw Coolant Control Valve
Precision valve managing deionized water coolant flow in wafer slicing saws that cut monocrystalline boules into thin silicon wafers. Falls under HTS 8481.90.9085 per statistical note (a)(ii)(B) for wafer preparation equipment parts. Critical for flatness and damage prevention.
Crystal Boule Grinder Pressure Valve
Hydraulic pressure regulating valve for crystal grinders that shape semiconductor boules to exact wafer diameters and flats indicating conductivity. HTS 8481.90.9085 applies as 'other' part per statistical note (a)(ii)(A) for boule grinding equipment.
Silicon Wafer Polisher DI Water Valve
Ultra-pure DI water delivery valve for final wafer polishers achieving mirror-finish surface flatness critical for device fabrication. HTS 8481.90.9085 per statistical note (a)(ii)(C) for wafer polishers in semiconductor prep.
Gallium Arsenide Wafer Gas Manifold Valve
Multi-port gas manifold valve for compound semiconductor (GaAs) wafer processing chambers controlling precursor gases. Falls under HTS 8481.90.9085 as 'other' parts for statistical note semiconductor materials processing.
Semiconductor Crystal Grinder Coolant Valve
Temperature-controlled coolant valve for grinders shaping crystal flats indicating resistivity/conductivity type on semiconductor boules. HTS 8481.90.9085 per note (a)(ii)(A).
Wire Bonding Machine Fluid Valve
Fluid control valve for wire bonding equipment in semiconductor packaging, managing cooling during gold/aluminum wire attachment to dies. HTS 8481.90.9085 as 'other' semiconductor processing part.
Die Attach Epoxy Dispenser Valve
Precision dispenser valve applying epoxy adhesive in die attach stations for semiconductor assembly. Classified HTS 8481.90.9085 under broader semiconductor processing provisions.
Plasma Etch Chamber Throttle Valve
Throttle valve regulating pressure in plasma etch chambers for semiconductor wafer patterning. HTS 8481.90.9085 as semiconductor processing apparatus part per statistical scope.