Wafer Slicing Saw Coolant Control Valve from Japan
Precision valve managing deionized water coolant flow in wafer slicing saws that cut monocrystalline boules into thin silicon wafers. Falls under HTS 8481.90.9085 per statistical note (a)(ii)(B) for wafer preparation equipment parts. Critical for flatness and damage prevention.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include saw equipment OEM specs confirming DI water purity requirements for classification support
• Declare flow rates (e.g
• 1-5 L/min) and material (PVDF for corrosion resistance) in commercial invoice