Wafer Prep Lapper Flow Regulator from Mexico
Adjustable flow regulator valve for lapping machines maintaining consistent slurry pressure across wafer surface for tolerance compliance. Under HTS 8481.90.9085, statistical (a)(ii)(C).
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document lapping pressure curves (5-20 psi) for statistical note support
• Consider EPA compliance for slurry waste if US-bound