Wafer Prep Lapper Flow Regulator from Japan
Adjustable flow regulator valve for lapping machines maintaining consistent slurry pressure across wafer surface for tolerance compliance. Under HTS 8481.90.9085, statistical (a)(ii)(C).
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document lapping pressure curves (5-20 psi) for statistical note support
• Consider EPA compliance for slurry waste if US-bound