Plasma Etch Chamber Throttle Valve from Germany
Throttle valve regulating pressure in plasma etch chambers for semiconductor wafer patterning. HTS 8481.90.9085 as semiconductor processing apparatus part per statistical scope.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Chamber pressure range (1-100 mTorr) critical spec
• RF plasma compatibility certification