Proportional Solenoid Control Valve for Semiconductor Wafer Etching from China
This electro-hydraulic proportional control valve precisely regulates gas flow in semiconductor wafer etching chambers based on electronic signals from a PLC controller. It falls under HTS 8481.80.9020 due to its design for proportional operation via control device signals, optimized for cleanroom environments in chip fabrication. Used in plasma etching tools to maintain exact pressure differentials.
Duty Rate — China → United States
37%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Verify actuator type and signal compatibility documentation to confirm proportional operation classification under 8481.80.9020
• Include cleanroom certification and material compatibility certificates (e.g
• for HF gases) to avoid reclassification as semiconductor-specific machinery