Control valves designed for proportional operation by a signal from a control device
Taps, cocks, valves and similar appliances, for pipes, boiler shells, tanks, vats or the like, including pressure-reducing valves and thermostatically controlled valves; parts thereof: > Other appliances: > Other > Other: > With electrical or electro-hydraulic actuators: > Control valves designed for proportional operation by a signal from a control device
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Products classified under HTS 8481.80.90.20
Servo-Controlled Proportional Valve for Wafer Grinding Coolant
This valve provides proportional control of coolant flow to diamond wafer grinders, responding to spindle load signals for maintaining optimal surface flatness during semiconductor wafer preparation. HTS 8481.80.9020 applies due to its electrical actuator designed for signal-proportional operation in crystal grinding equipment. Critical for achieving nanometer-level wafer tolerances.
Digital Proportional Control Valve for CVD Chamber Precursor Flow
This valve proportionally meters toxic precursor gases into chemical vapor deposition chambers for gallium arsenide wafer processing, responding to mass flow controller signals. HTS 8481.80.9020 classification for proportional signal-operated control valves used in semiconductor device fabrication equipment. Features fail-safe positioning for hazardous gas handling.
Proportional Solenoid Control Valve for Semiconductor Wafer Etching
This electro-hydraulic proportional control valve precisely regulates gas flow in semiconductor wafer etching chambers based on electronic signals from a PLC controller. It falls under HTS 8481.80.9020 due to its design for proportional operation via control device signals, optimized for cleanroom environments in chip fabrication. Used in plasma etching tools to maintain exact pressure differentials.
Electro-Pneumatic Proportional Valve for Crystal Puller Gas Control
Designed for Czochralski crystal growers, this proportional valve modulates argon gas flow based on real-time signals from temperature controllers during silicon boule pulling. Classified in 8481.80.9020 for its electro-pneumatic actuator responding proportionally to control signals in semiconductor material growth equipment. Ensures ultra-precise atmosphere control to prevent crystal defects.
Proportional Pressure Control Valve for Float Zone Crystal Furnace
Used in float zone furnaces for growing high-purity silicon crystals, this valve proportionally adjusts process gas pressure via electronic signals from vacuum controllers. Falls under 8481.80.9020 as a control valve designed for proportional signal operation in semiconductor crystal manufacturing apparatus. Maintains zone stability during melting without crucible contamination.
Analog Signal Proportional Valve for Wafer Slicing Coolant System
Precision valve for inner/outer diameter coolant control in wafer slicing saws, proportionally modulating flow based on blade torque feedback signals. Classified 8481.80.9020 for proportional operation by control device signals in semiconductor wafer preparation equipment. Enables damage-free slicing of monocrystalline boules into thin wafers.
Proportional Exhaust Valve for Semiconductor Plasma Chamber
Throttle valve proportionally controls exhaust pressure in plasma etching/reactive ion etching chambers based on ion gauge signals from vacuum controllers. Designed for 8481.80.9020 as signal-proportional control valve for semiconductor device processing apparatus. Maintains stable plasma density during wafer pattern transfer.