Servo-Controlled Hydraulic Pressure Reducing Valve for Wafer Lappers from Germany
Servo-controlled hydraulic valve precisely regulating lapping pressure on semiconductor wafers to achieve critical flatness specifications before fabrication. HTS 8481.10.0020 for hydraulic fluid power pressure-reducing valves in wafer preparation equipment. Essential for maintaining wafer surface flatness tolerances.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide lapping pressure vs. removal rate correlation data for CBP verification,Include servo response time specifications matching lapping process requirements,Document cleanroom compatibility and particle generation specifications