Hydraulic Relief Pressure Valve for Wafer Polishing Equipment from Germany
Hydraulic relief valve reducing pressure in polishing head hydraulic systems for final semiconductor wafer surface preparation. Classified HTS 8481.10.0020 as hydraulic fluid power pressure-reducing valve per statistical notes for wafer polishers. Maintains precise polishing pressure for mirror surface finish.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include polishing slurry pressure specifications and valve response characteristics,Certify materials for chemical mechanical planarization (CMP) slurry compatibility,Document pressure uniformity specifications across polishing pad surface area