Hydraulic Back Pressure Regulator for Crystal Boule Grinders from Japan
Back pressure hydraulic regulator maintaining consistent grinding force on semiconductor crystal boules during diameter precision grinding for wafer production. Classifies under HTS 8481.10.0020 as hydraulic fluid power pressure-reducing valve for wafer manufacturing equipment. Critical for achieving required boule diameter tolerances.
Duty Rate — Japan → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document grinding wheel pressure requirements matching regulator specifications,Include flat grinding pattern specifications for conductivity indication flats,Verify hydraulic fluid certification for minimal contamination in semiconductor processing