Wafer Shippers Protective Mold from Japan
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document cleanroom compatibility (ISO Class 1-5) and anti-static properties in technical datasheets
• Link molds to specific wafer formats (200mm/300mm) in import declarations
• Avoid bulk packaging declarations that might suggest general plastics molding