Wafer Shippers Protective Mold from Japan
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document cleanroom compatibility (ISO Class 1-5) and anti-static properties in technical datasheets
• Link molds to specific wafer formats (200mm/300mm) in import declarations
• Avoid bulk packaging declarations that might suggest general plastics molding