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Wafer Shippers Protective Mold from Japan

Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Import Tips

Document cleanroom compatibility (ISO Class 1-5) and anti-static properties in technical datasheets

Link molds to specific wafer formats (200mm/300mm) in import declarations

Avoid bulk packaging declarations that might suggest general plastics molding

Wafer Shippers Protective Mold from Japan — Import Duty Rate | HTS 8480.71.40.00