Wafer Shippers Protective Mold from Japan
Injection mold for custom foam-like plastic inserts and shippers protecting semiconductor wafers during transport between fabs. Qualifies under HTS 8480.71.40.00 for supporting semiconductor manufacturing logistics.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document cleanroom compatibility (ISO Class 1-5) and anti-static properties in technical datasheets
• Link molds to specific wafer formats (200mm/300mm) in import declarations
• Avoid bulk packaging declarations that might suggest general plastics molding