8480.71.40.00/Silicon Wafer Injection Mold/China

Silicon Wafer Injection Mold from China

Precision injection mold designed specifically for manufacturing plastic carrier trays and handling tools used in semiconductor wafer processing. It falls under HTS 8480.71.40.00 because it is an injection-type mold for plastics explicitly used in the production of semiconductor devices, aligning with statistical notes on wafer manufacturing equipment.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Provide detailed engineering drawings and end-use certification proving the mold's role in semiconductor device fabrication to qualify for this specific subheading

• Ensure molds meet precision tolerances documented in specs; customs may require proof of compatibility with wafer processing equipment

• Avoid misclassification as general plastic molds (8480.71.40.90); include affidavits from buyers confirming semiconductor application