Semiconductor Chip Carrier Tray Mold from Mexico
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit photos/specs showing ESD-safe design and wafer size compatibility (e.g
• 300mm) for classification support
• Pair with buyer letters confirming use in cleanroom semiconductor environments
• Watch for reclassification if trays resemble general packaging—emphasize semiconductor handling function