8480.71.40.00/Semiconductor Chip Carrier Tray Mold/Japan

Semiconductor Chip Carrier Tray Mold from Japan

Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit photos/specs showing ESD-safe design and wafer size compatibility (e.g

• 300mm) for classification support

• Pair with buyer letters confirming use in cleanroom semiconductor environments

• Watch for reclassification if trays resemble general packaging—emphasize semiconductor handling function