Semiconductor Chip Carrier Tray Mold from Japan
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit photos/specs showing ESD-safe design and wafer size compatibility (e.g
• 300mm) for classification support
• Pair with buyer letters confirming use in cleanroom semiconductor environments
• Watch for reclassification if trays resemble general packaging—emphasize semiconductor handling function