Semiconductor Chip Carrier Tray Mold from Germany
Multi-cavity injection mold producing plastic trays for transporting and storing semiconductor wafers and chips during fabrication. Meets HTS 8480.71.40.00 criteria for injection molds used in semiconductor device manufacture.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit photos/specs showing ESD-safe design and wafer size compatibility (e.g
• 300mm) for classification support
• Pair with buyer letters confirming use in cleanroom semiconductor environments
• Watch for reclassification if trays resemble general packaging—emphasize semiconductor handling function