8480.71.40.00/QFN Package Encapsulation Mold/Japan

QFN Package Encapsulation Mold from Japan

Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide evidence of mold's compatibility with thin-wall QFN molding processes and vent designs

• Use advance rulings for complex multi-cavity designs to confirm semiconductor classification

• Label clearly as 'semiconductor exclusive' to prevent general plastics reclassification