QFN Package Encapsulation Mold from Germany
Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide evidence of mold's compatibility with thin-wall QFN molding processes and vent designs
• Use advance rulings for complex multi-cavity designs to confirm semiconductor classification
• Label clearly as 'semiconductor exclusive' to prevent general plastics reclassification