QFN Package Encapsulation Mold from China
Precision injection mold for Quad Flat No-lead (QFN) semiconductor package encapsulation, featuring fine-pitch cavities for exposed pad designs. HTS 8480.71.40.00 applies due to dedicated semiconductor device molding function.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide evidence of mold's compatibility with thin-wall QFN molding processes and vent designs
• Use advance rulings for complex multi-cavity designs to confirm semiconductor classification
• Label clearly as 'semiconductor exclusive' to prevent general plastics reclassification