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8480.49.00.90/Wafer Thickness Control Mold/Mexico

Wafer Thickness Control Mold from Mexico

Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.

Duty Rate — Mexico → United States

13.1%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Include real-time thickness measurement integration

• Specify TTV (total thickness variation) capabilities