Wafer Thickness Control Mold from Mexico
Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.
Duty Rate — Mexico → United States
13.1%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include real-time thickness measurement integration
• Specify TTV (total thickness variation) capabilities