Wafer Thickness Control Mold from Japan
Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include real-time thickness measurement integration
• Specify TTV (total thickness variation) capabilities