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8480.49.00.90/Wafer Thickness Control Mold/Japan

Wafer Thickness Control Mold from Japan

Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include real-time thickness measurement integration

• Specify TTV (total thickness variation) capabilities

Wafer Thickness Control Mold from Japan — Import Duty Rate | HTS 8480.49.00.90