8480.49.00.90/Wafer Thickness Control Mold/Germany

Wafer Thickness Control Mold from Germany

Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.

Duty Rate — Germany → United States

13.1%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include real-time thickness measurement integration

• Specify TTV (total thickness variation) capabilities