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8480.49.00.90/Wafer Thickness Control Mold/Germany

Wafer Thickness Control Mold from Germany

Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Include real-time thickness measurement integration

• Specify TTV (total thickness variation) capabilities

Wafer Thickness Control Mold from Germany — Import Duty Rate | HTS 8480.49.00.90