Wafer Thickness Control Mold from Canada
Mold system for in-process thickness control during semiconductor wafer grinding/lapping operations. Falls under HTS 8480.49.0090 as other wafer preparation molds.
Duty Rate — Canada → United States
13.1%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include real-time thickness measurement integration
• Specify TTV (total thickness variation) capabilities