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8480.49.00.90/SiC Wafer Growth Mold/Japan

SiC Wafer Growth Mold from Japan

Mold for silicon carbide (SiC) crystal growth used in power semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor materials processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document high-temperature capability (>2000°C)

• Specify sublimation growth process (PVT method)

• SiC molds require special high-purity certifications

SiC Wafer Growth Mold from Japan — Import Duty Rate | HTS 8480.49.00.90