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8480.49.00.90/Sapphire Wafer Substrate Mold/Japan

Sapphire Wafer Substrate Mold from Japan

Mold for growing sapphire boules used as substrates for LED/GaN semiconductor wafers. HTS 8480.49.0090 covers metal carbide molds for semiconductor material processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document sapphire as semiconductor substrate material

• Specify boule growth method (Kyropoulos/Heat Exchange)