Wafer Lapping Machine from Mexico
Equipment that lap semiconductor wafers to precise thickness and flatness using abrasive slurries. Falls under HTS 8479.90.95 per statistical note for wafer preparation apparatus. Critical for achieving total thickness variation (TTV) specifications.
Duty Rate — Mexico → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include slurry composition and platen rotation specs in technical documentation
• Certify machine achieves TTV <1μm, distinguishing from general polishers