8479.90.95/Wafer Lapping Machine/Japan

Wafer Lapping Machine from Japan

Equipment that lap semiconductor wafers to precise thickness and flatness using abrasive slurries. Falls under HTS 8479.90.95 per statistical note for wafer preparation apparatus. Critical for achieving total thickness variation (TTV) specifications.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include slurry composition and platen rotation specs in technical documentation

• Certify machine achieves TTV <1μm, distinguishing from general polishers

Wafer Lapping Machine from Japan — Import Duty Rate | HTS 8479.90.95