Semiconductor Wafer Lapper from Japan
Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Specify total thickness variation (TTV) capabilities (<0.5 microns typical) in technical literature
• Demonstrate double-sided lapping mechanism specific to semiconductor wafers
• Avoid misclassification by documenting slurry compatibility with silicon/gallium arsenide