8479.90.95.96/Semiconductor Wafer Lapper/Japan

Semiconductor Wafer Lapper from Japan

Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify total thickness variation (TTV) capabilities (<0.5 microns typical) in technical literature

• Demonstrate double-sided lapping mechanism specific to semiconductor wafers

• Avoid misclassification by documenting slurry compatibility with silicon/gallium arsenide

Semiconductor Wafer Lapper from Japan — Import Duty Rate | HTS 8479.90.95.96