Semiconductor Wafer Lapper from Canada
Wafer lappers use loose abrasive slurries to lap both sides of semiconductor wafers simultaneously, achieving critical flatness for device fabrication. HTS 8479.90.95.96 covers this wafer preparation equipment essential for semiconductor processing.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify total thickness variation (TTV) capabilities (<0.5 microns typical) in technical literature
• Demonstrate double-sided lapping mechanism specific to semiconductor wafers
• Avoid misclassification by documenting slurry compatibility with silicon/gallium arsenide