8479.90.95.96/Precision Wafer Edge Grinder/Mexico

Precision Wafer Edge Grinder from Mexico

Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8479.90.95.96 covers this critical wafer preparation for fabrication yield improvement.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge profile geometries (SEMI M1 standards) and chamfer angle precision

• Document handling of thin wafers (<100 microns) without breakage

• Risk of 8460.90 classification without semiconductor wafer cassette compatibility

Precision Wafer Edge Grinder from Mexico — Import Duty Rate | HTS 8479.90.95.96