Precision Wafer Edge Grinder from Canada
Wafer edge grinders chamfer and profile semiconductor wafer edges to prevent chipping during handling and processing. HTS 8479.90.95.96 covers this critical wafer preparation for fabrication yield improvement.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify edge profile geometries (SEMI M1 standards) and chamfer angle precision
• Document handling of thin wafers (<100 microns) without breakage
• Risk of 8460.90 classification without semiconductor wafer cassette compatibility