Gallium Arsenide Wafer Slicer from Japan
Specialized wafer slicers for brittle gallium arsenide compound semiconductor boules, featuring inner-diameter diamond saws with tension control. Falls under HTS 8479.90.95.96 for compound semiconductor wafer preparation.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document tension control and blade runout specifications for compound semiconductor handling
• Include material compatibility certification for gallium arsenide processing
• Avoid 8461.50 if lacking GaAs-specific feed rates and coolant systems