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Gallium Arsenide Wafer Slicer from Canada

Specialized wafer slicers for brittle gallium arsenide compound semiconductor boules, featuring inner-diameter diamond saws with tension control. Falls under HTS 8479.90.95.96 for compound semiconductor wafer preparation.

Duty Rate — Canada → United States

15%

Rate breakdown

9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter

Import Tips

Document tension control and blade runout specifications for compound semiconductor handling

Include material compatibility certification for gallium arsenide processing

Avoid 8461.50 if lacking GaAs-specific feed rates and coolant systems