Double-Sided Wafer Polisher from Germany
Double-sided wafer polishers use chemical-mechanical polishing (CMP) to achieve mirror-finish flatness on semiconductor wafers for fabrication processing. Classified under HTS 8479.90.95.96 as critical wafer preparation apparatus.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include CMP slurry specifications and polishing pad materials compatible with semiconductor processes
• Document achievable surface roughness (Angstrom-level) essential for classification