Double-Sided Wafer Polisher from Canada
Double-sided wafer polishers use chemical-mechanical polishing (CMP) to achieve mirror-finish flatness on semiconductor wafers for fabrication processing. Classified under HTS 8479.90.95.96 as critical wafer preparation apparatus.
Duty Rate — Canada → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include CMP slurry specifications and polishing pad materials compatible with semiconductor processes
• Document achievable surface roughness (Angstrom-level) essential for classification