Wafer Lapping Machine Platen Assembly from Japan
Precision platen assembly for wafer lapping machines that achieve critical flatness tolerances on semiconductor wafers before polishing. HTS 8479.90.95.65 covers these parts of metal surface treating apparatus.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include flatness specification sheets (e.g
• <1 micron across 300mm wafers)
• Provide slurry compatibility documentation for silicon carbide lapping processes
• Maintain assembly integrity during shipping to preserve platen surface finish