8479.90.95.65/Wafer Lapper Conditioning Ring/Japan

Wafer Lapper Conditioning Ring from Japan

Diamond pellet conditioning ring maintaining lapping plate flatness during semiconductor wafer preparation. HTS 8479.90.95.65 parts for metal surface treating lapping machines.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify diamond grit size and distribution pattern

• Document conditioning sweep patterns for uniform plate wear

• Measure ring flatness to <2 microns specification

Wafer Lapper Conditioning Ring from Japan — Import Duty Rate | HTS 8479.90.95.65