Wafer Lapper Conditioning Ring from Canada
Diamond pellet conditioning ring maintaining lapping plate flatness during semiconductor wafer preparation. HTS 8479.90.95.65 parts for metal surface treating lapping machines.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify diamond grit size and distribution pattern
• Document conditioning sweep patterns for uniform plate wear
• Measure ring flatness to <2 microns specification