Wafer Edge Grinder Collet Chuck from Germany
Vacuum collet chuck for holding wafers during edge grinding to remove micro-cracks and achieve chip strength specifications. HTS 8479.90.95.65 for parts of semiconductor wafer preparation grinders.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify vacuum port configurations match industry-standard wafer handling tools
• Provide edge grind geometry specifications (chamfer angles, radii)
• Include particle generation test data for cleanroom compatibility