Diamond Wire Wafer Saw Tensioning Mechanism from Japan
Precision tensioning system for maintaining constant wire tension during high-speed wafer slicing from silicon boules. Classified in HTS 8479.90.95.65 as parts of semiconductor wafer manufacturing saws.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Calibrate tension sensors to ±0.1N specifications before import inspection
• Include wire break detection system integration documentation
• Specify wire speed compatibility (20-100 m/s ranges)