Diamond Wire Wafer Saw Tensioning Mechanism from Canada
Precision tensioning system for maintaining constant wire tension during high-speed wafer slicing from silicon boules. Classified in HTS 8479.90.95.65 as parts of semiconductor wafer manufacturing saws.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Calibrate tension sensors to ±0.1N specifications before import inspection
• Include wire break detection system integration documentation
• Specify wire speed compatibility (20-100 m/s ranges)