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8479.90.41.00/Semiconductor Wafer Polishing Platen/Japan

Semiconductor Wafer Polishing Platen from Japan

Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document surface flatness specs (bow/warp <20nm) and polishing pad compatibility,Include cleanroom compatibility certification (ISO Class 1-3),Not classifiable as general polishing equipment under 8460

Semiconductor Wafer Polishing Platen from Japan — Import Duty Rate | HTS 8479.90.41.00