8479.90.41.00/Semiconductor Wafer Polishing Platen/Germany

Semiconductor Wafer Polishing Platen from Germany

Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

Calculate with your customs value Verify classification with AI

Import Tips

• Document surface flatness specs (bow/warp <20nm) and polishing pad compatibility,Include cleanroom compatibility certification (ISO Class 1-3),Not classifiable as general polishing equipment under 8460