Semiconductor Wafer Polishing Platen from China
Rotary platen assembly for wafer polishers that create mirror-finish surfaces on semiconductor wafers prior to device fabrication. Maintains flatness critical for photolithography overlay. Classified under 8479.90.41.00 as part of wafer polishers in 8479.89.10.
Duty Rate — China → United States
17.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document surface flatness specs (bow/warp <20nm) and polishing pad compatibility,Include cleanroom compatibility certification (ISO Class 1-3),Not classifiable as general polishing equipment under 8460