Wafer Slicing Diamond Saw from China
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8479.89.95.99 applies to this wafer preparation equipment as defined in statistical notes. Maintains crystal orientation during kerfless cutting.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify blade thickness (<50 microns) and slicing tolerances to differentiate from general saws
• Document wire/coolant systems for thin wafer integrity to support wafer-specific classification