Wafer Slicing Diamond Saw from Canada
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8479.89.95.99 applies to this wafer preparation equipment as defined in statistical notes. Maintains crystal orientation during kerfless cutting.
Duty Rate — Canada → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify blade thickness (<50 microns) and slicing tolerances to differentiate from general saws
• Document wire/coolant systems for thin wafer integrity to support wafer-specific classification