Silicon Ingot Grinder from Germany
Precision grinder for shaping silicon ingots to exact diameters with orientation notches before wafer slicing in semiconductor production. Falls under HTS 8479.89.95.99 as crystal boule grinder per statistical note (a)(ii)(A). Ensures consistent wafer quality.
Duty Rate — Germany → United States
12.5%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify ingot diameters (150-450mm) and flat/notch grinding patterns for dopant indication
• Provide vacuum chuck specs for handling cylindrical crystals without contamination